Wafer Fabrication Equipment

  1. OSIRIS INTERNATIONAL MANUAL WAFER DEBONDING TOOL

    Other Wafer Fabrication Equipment

    OSIRIS INTERNATIONAL MANUAL WAFER DEBONDING TOOL

    Manual Wafer Debonding Tool

  2. REYNOLDSTECH 16 'X 16', HOT PLATE 200° C,

    Other Wafer Fabrication Equipment

    REYNOLDSTECH 16 'X 16', HOT PLATE 200° C,

    200° C 16 " x 16" Hot Plate with Vacuum Hold Down

  3. LOGITECH WAFER BONDER CONTROLLER

    Other Wafer Fabrication Equipment

    LOGITECH WAFER BONDER CONTROLLER

    Wafer Bonder Controller

  4. EV GROUP SMARTVIEW® BOND ALIGNER

    Other Wafer Fabrication Equipment

    EV GROUP SMARTVIEW® BOND ALIGNER

    2005 SmartView® Semi-Automated Wafer-to-Wafer Bond Aligner The EV Group (EVG) Smartview® Bond aligner and EV Group (EVG) 540 Wafer Bonder are used in the production of MEMs and in the emerging fields of 3D IC Packaging and Through-Silicon Via (TSV) interconnects.

    A 3D integrated circuit (3D IC) is a single integrated circuit built by stacking silicon wafers and/or dies and interconnecting them vertically. This is achieved by persisly aligning devices on two silicon wafers and subsequently bonding them together. The result is they behave as a single device. By using TSV technology, 3D ICs can pack a great deal of functionality into a small “footprint.” This technology is not olny used in the production of MEMS, but also in the fabrication of CMOS image sensors, and memory devices.

  5. SHARON VACUUM WAFER BONDER

    Other Wafer Fabrication Equipment

    SHARON VACUUM WAFER BONDER

    Wafer Bonder Sharon Vacuum